Thin plates are very often employed in a context of large displacements and rotations, for example, whenever the extreme flexibility of a body can replace the use of complicated kinematic pairs. This is the case of the flexible Printed Circuit Boards (PCBs) used, for example, within last-generation foldable laptops and consumer electronics products. In these applications, the range of motion is generally known in advance, and a simple strategy of stress assessment leaving out nonlinear numerical calculations appears feasible other than desirable. In this paper, Radial Basis Functions (RBFs) are used to represent a generic transformation of a bi-dimensional plate, with all the derivate fields being analytically achieved without the need for a numerical grid for large-displacement applications. Strains due to bending are easily retrieved with this method and satisfactorily compared to analytical and shell-based Finite Element Method (FEM) benchmarks. On the other hand, the computational costs of the juxtaposed methods appear far different; with the machine being equal, the orders of magnitude of the time elapsed in computation are seconds for the RBF-based strategy versus minutes for the FEM approach.
Keywords: flexible printed circuit boards; large displacements; meshless; radial basis functions.