Highly Thermally Conductive Epoxy Composites with AlN/BN Hybrid Filler as Underfill Encapsulation Material for Electronic Packaging

William Anderson Lee Sanchez; Jia-Wun Li; Hsien-Tang Chiu; Chih-Chia Cheng; Kuo-Chan Chiou; Tzong-Ming Lee; Chih-Wei Chiu

doi:10.3390/polym14142950

Highly Thermally Conductive Epoxy Composites with AlN/BN Hybrid Filler as Underfill Encapsulation Material for Electronic Packaging

Polymers (Basel). 2022 Jul 21;14(14):2950. doi: 10.3390/polym14142950.

Authors

William Anderson Lee Sanchez¹, Jia-Wun Li¹, Hsien-Tang Chiu¹, Chih-Chia Cheng², Kuo-Chan Chiou³, Tzong-Ming Lee³, Chih-Wei Chiu¹

Affiliations

¹ Department of Materials Science and Engineering, National Taiwan University of Science and Technology, Taipei 10607, Taiwan.
² Graduate Institute of Applied Science and Technology, National Taiwan University of Science and Technology, Taipei 10607, Taiwan.
³ Material and Chemical Research Laboratories, Industrial Technology Research Institute, Hsinchu 31040, Taiwan.

Abstract

In this study, the effects of a hybrid filler composed of zero-dimensional spherical AlN particles and two-dimensional BN flakes on the thermal conductivity of epoxy resin were studied. The thermal conductivity (TC) of the pristine epoxy matrix (EP) was 0.22 W/(m K), while the composite showed the TC of 10.18 W/(m K) at the 75 wt% AlN-BN hybrid filler loading, which is approximately a 46-fold increase. Moreover, various essential application properties were examined, such as the viscosity, cooling rate, coefficient of thermal expansion (CTE), morphology, and electrical properties. In particular, the AlN-BN/EP composite showed higher thermal stability and lower CTE (22.56 ppm/°C) than pure epoxy. Overall, the demonstrated outstanding thermal performance is appropriate for the production of electronic packaging materials, including next-generation flip-chip underfills.

Keywords: aluminum nitride; boron nitride; electronic encapsulation packaging; hybrid filler; thermal conductivity; underfill material; viscosity.

Grants and funding

This research was funded by the Ministry of Science and Technology (MOST 110-2622-E-011-028, MOST 111-2628-E-011-009-MY3, and MOST 111-2622-8-011-009-TE2) of Taiwan.