Solution-Processed Silicon Doped Tin Oxide Thin Films and Thin-Film Transistors Based on Tetraethyl Orthosilicate

Membranes (Basel). 2022 Jun 1;12(6):590. doi: 10.3390/membranes12060590.

Abstract

Recently, tin oxide (SnO2) has been the preferred thin film material for semiconductor devices such as thin-film transistors (TFTs) due to its low cost, non-toxicity, and superior electrical performance. However, the high oxygen vacancy (VO) concentration leads to poor performance of SnO2 thin films and devices. In this paper, with tetraethyl orthosilicate (TEOS) as the Si source, which can decompose to release heat and supply energy when annealing, Si doped SnO2 (STO) films and inverted staggered STO TFTs were successfully fabricated by a solution method. An XPS analysis showed that Si doping can effectively inhibit the formation of VO, thus reducing the carrier concentration and improving the quality of SnO2 films. In addition, the heat released from TEOS can modestly lower the preparation temperature of STO films. By optimizing the annealing temperature and Si doping content, 350 °C annealed STO TFTs with 5 at.% Si exhibited the best device performance: Ioff was as low as 10-10 A, Ion/Ioff reached a magnitude of 104, and Von was 1.51 V. Utilizing TEOS as an Si source has a certain reference significance for solution-processed metal oxide thin films in the future.

Keywords: oxygen vacancy; tetraethyl orthosilicate; thin-film transistors; tin oxide.

Grants and funding

This work was supported by National Natural Science Foundation of China (Grant No.22090024 and 62174057), Southwest Institute of Technology and Engineering Cooperation Fund (HDHDW5902020402), Key-Area Research and Development Program of Guangdong Province (No.2020B010183002), Special Fund for Science and Technology Innovation Strategy of Guangdong Province in 2021 (“Big Special Project+Task List”) Project(No.210908174533730), Guangdong Major Project of Basic and Applied Basic Research (No.2019B030302007), National Natural Science Foundation of China (Grant No.62074059) and Ji Hua Laboratory scientific research project (X190221TF191).