Editorial for the Special Issue "MEMS Packaging Technologies and 3D Integration"

Seonho Seok

doi:10.3390/mi13050749

Editorial for the Special Issue "MEMS Packaging Technologies and 3D Integration"

Micromachines (Basel). 2022 May 9;13(5):749. doi: 10.3390/mi13050749.

Author

Seonho Seok¹

Affiliation

¹ Center for Nanoscience and Nanotechnology (C2N), University-Paris-Saclay, 91400 Orsay, France.

Abstract

As fabrication technologies advance, the packaging of MEMS device is being developed in two main directions: MEMS device packaging and MEMS or sensor system integration [...].

Publication types

Editorial