Improving the curing and flame retardancy of epoxy resin composites by multifunctional Si-containing cyclophosphazene derivatives

Wang-Xi Fan; Zefang Li; Zhou Yang; Jun-Fei Ou; Meng Xiang; Zhong-Li Qin

doi:10.1039/d1ra08843b

Improving the curing and flame retardancy of epoxy resin composites by multifunctional Si-containing cyclophosphazene derivatives

RSC Adv. 2022 May 6;12(22):13756-13764. doi: 10.1039/d1ra08843b. eCollection 2022 May 5.

Authors

Wang-Xi Fan¹, Zefang Li², Zhou Yang¹, Jun-Fei Ou¹, Meng Xiang¹, Zhong-Li Qin³

Affiliations

¹ School of Materials Engineering, Jiangsu University of Technology Changzhou China.
² School of Computer Engineering, Jiangsu University of Technology Changzhou China.
³ School of Electronics and Information Engineering, Hubei University of Science and Technology Xianning China qinzhongli@hbust.edu.cn.

Abstract

Novel star-like molecules containing P, N and Si with dual functions of flame retardance and curing promotion (abridged as HCCP-KH540) were successfully synthesized through the nucleophilic substitution reaction of hexachlorocyclotriphosphazene (HCCP) and 3-aminopropyltrimethoxysilane (KH540). HCCP-KH540 was incorporated with the matrix of epoxy resin (EP) to form a flame retardant composite abridged as E-HK. The activation energy of the curing reaction of the E-HK composite was reduced but the curing reaction rate was accelerated by HCCP-KH540. The E-HK composite with 30 phr content of HCCP-KH540 exhibited excellent flame retardancy with limiting oxygen index of 29.6% and V-1 rating in the vertical burning test as well as excellent thermal stability with a char yield of 23.77% at 700 °C, compared with only 8.64% for pure EP.