Heat Source Modeling and Residual Stress Analysis for Metal Directed Energy Deposition Additive Manufacturing

Materials (Basel). 2022 Mar 30;15(7):2545. doi: 10.3390/ma15072545.

Abstract

The advancement in additive manufacturing encourages the development of simplified tools for deep and swift research of the technology. Several approaches were developed to reduce the complexity of multi-track modeling for additive manufacturing. In the present work, a simple heat source model called concentrated heat source was evaluated for single- and multi-track deposition for directed energy deposition. The concentrated heat source model was compared with the widely accepted Goldak heat source model. The concentrated heat source does not require melt pool dimension measurement for thermal model simulation. Thus, it reduces the considerable time for preprocessing. The shape of the melt pool and temperature contour around the heat source was analyzed for single-track deposition. A good agreement was noticed for the concentrated heat source model melt pool, with an experimentally determined melt pool, using an optical microscope. Two heat source models were applied to multi-track 3D solid structure thermo-mechanical simulation. The results of the two models, for thermal history and residual stress, were compared with experimentally determined data. A good agreement was found for both models. The concentrated heat source model reported less than the half the computational time required for the Goldak model. The validated model, for 3D solid structure thermo-mechanical simulation, was used to analyze thermal stress evolution during the deposition process. The material deposition on the base plate at room temperature results in lower peak temperatures in the layers near the base plate. Consequently, the higher thermal stress in the layers near the base plate was found, compared to the upper layers during the deposition process.

Keywords: additive manufacturing; concentrated heat source; directed energy deposition; goldak model; moving heat source; residual stress; thermal stress.