Liquid metal (LM) droplets covered with functional materials, especially metallic, often make breakthroughs in performance and functionality. In this study, self-assembly was used to synthesize copper films on the surface of LM. Herein, using CuO nanoparticles as the monomers, driven by the electrostatic interaction between CuO and eutectic gallium-indium (EGaIn) in the alkaline environment, EGaIn@Cu is realized by taking advantage of the reducing property of the EGaIn-alkaline interface. The copper film is smooth and dense, and under its protection, a layer of gallium oxide remains on the reaction interface between copper and LM, which enabled EGaIn@Cu to possess the volt-ampere curves similar to the Schottky mode, showing that the proposed mechanism has the potential to be used in the bottom-up synthesis of the semiconductor junction. Owing to the support of the copper film, the stiffness coefficient of the LM droplet can be increased by 56.9%. Coupled with the melting latent heat of 55.46 J/g and the natural high density of metal, EGaIn@Cu is also a potential phase change capsule. In addition, a method based on stream jetting and self-breaking up mechanisms of LM to batch-produce sub-millimeter capsules was also introduced. The above structural and functional characteristics demonstrate the value of this work in related fields.
Keywords: copper film; core−shell composite; flexible electronics; liquid metal; phase change capsule; self-assembly; semiconductor.