Morphological Stability of Copper Surfaces under Reducing Conditions

ACS Appl Mater Interfaces. 2021 Oct 20;13(41):48730-48744. doi: 10.1021/acsami.1c13989. Epub 2021 Oct 6.

Abstract

Though copper is a capable electrocatalyst for the CO2 reduction reaction (CO2RR), it rapidly deactivates to produce mostly hydrogen. A current hypothesis as to why this occurs is that potential-induced morphological restructuring takes place, leading to a redistribution of the facets at the interface resulting in a shift in the catalytic activity to favor the hydrogen evolution reaction over CO2RR. Here, we investigate the veracity of this hypothesis by studying the changes in the voltammetry of various copper surfaces, specifically the three principal orientations and a polycrystalline surface, after being subjected to strongly cathodic conditions. The basal planes were chosen as model catalysts, while polycrystalline copper was included as a means of investigating the overall behavior of defect-rich facets with many low coordination steps and kink sites. We found that all surfaces exhibited (perhaps surprisingly) high stability when subjected to strongly cathodic potentials in a concentrated alkaline electrolyte (10 M NaOH). Proof for morphological stability under CO2RR-representative conditions (60 min at -0.75 V in 0.5 M KHCO3) was obtained from identical location scanning electron microscopy, where the mesoscopic morphology for a nanoparticle-covered copper surface was found unchanged to within the instrument accuracy. Observed changes in voltammetry under such conditions, we found, were not indicative of a redistribution of surface sites but of electrode fouling. Besides impurities, we show that (brief) exposure to oxygen or oxidizing conditions (i.e., 1 min) leads to copper exhibiting changing morphology upon cathodic treatment which, we posit, is ultimately the reason why many groups report the evolution of copper morphology during CO2RR: accidental oxidation/reduction cycles.

Keywords: CO2; CO2RR; Cu; Cu(100); Cu(110); Cu(111); cathodic corrosion; copper; morphology; reduction; single crystal; stability.