Thermal management is one of the main challenges in the most demanding detector technologies and for the future of microelectronics. Microfluidic cooling has been proposed as a fully integrated solution to the heat dissipation problem in modern high-power microelectronics. Traditional manufacturing of silicon-based microfluidic devices involves advanced, mask-based lithography techniques for surface patterning. The limited availability of such facilities prevents widespread development and use. We demonstrate the relevance of maskless laser writing to advantageously replace lithographic steps and provide a more prototype-friendly process flow. We use a 20 W infrared laser with a pulse duration of 50 ps to engrave and drill a 525 μm-thick silicon wafer. Anodic bonding to a SiO2 wafer is used to encapsulate the patterned surface. Mechanically clamped inlet/outlet connectors complete the fully operational microcooling device. The functionality of the device has been validated by thermofluidic measurements. Our approach constitutes a modular microfabrication solution that should facilitate prototyping studies of new concepts for co-designed electronics and microfluidics.
Keywords: laser materials processing; microcooling; microfluidic device.