Interdiffusion and Intermetallic Compounds at Al/Cu Interfaces in Al-50vol.%Cu Composite Prepared by Solid-State Sintering

Dasom Kim; Kyungju Kim; Hansang Kwon

doi:10.3390/ma14154307

Interdiffusion and Intermetallic Compounds at Al/Cu Interfaces in Al-50vol.%Cu Composite Prepared by Solid-State Sintering

Materials (Basel). 2021 Jul 31;14(15):4307. doi: 10.3390/ma14154307.

Authors

Dasom Kim¹, Kyungju Kim², Hansang Kwon^{1

3}

Affiliations

¹ Department of Materials System Engineering, Pukyong National University, Busan 48547, Korea.
² The Industrial Science Technology Research Center, Pukyong National University, Busan 48547, Korea.
³ Department of R&D, Next Generation Materials Co., Ltd., Busan 48547, Korea.

Abstract

Al-Cu composites have attracted significant interest recently owing to their lightweight nature and remarkable thermal properties. Understanding the interdiffusion mechanism at the numerous Al/Cu interfaces is crucial to obtain Al-Cu composites with high thermal conductivities. The present study systematically investigates the interdiffusion mechanism at Al/Cu interfaces in relation to the process temperature. Al-50vol.%Cu composite powder, where Cu particles were encapsulated in a matrix of irregular Al particles, was prepared and then sintered at various temperatures from 340 to 500 °C. Intermetallic compounds (ICs) such as CuAl₂ and Cu₉Al₄ were formed at the Al/Cu interfaces during sintering. Microstructural analysis showed that the thickness of the interdiffusion layer, which comprised the CuAl₂ and Cu₉Al₄ ICs, drastically increased above 400 °C. The Vickers hardness of the Al-50vol.%Cu composite sintered at 380 °C was 79 HV, which was 1.5 times that of the value estimated by the rule of mixtures. A high thermal conductivity of 150 W∙m^-1∙K^-1 was simultaneously obtained. This result suggests that the Al-50vol.%Cu composite material with large number of Al/Cu interfaces, as well as good mechanical strength and heat conductance, can be prepared by solid-state sintering at a low temperature.

Keywords: aluminium; copper; interdiffusion; intermetallic compound; metal matrix composite; solid-state sintering; thermal conductivity.