The most common failure mode of implantable neural implants has been delamination of layers in compound structures and encapsulations in a wet body environment. Current knowledge of failure mechanisms of adhesion and its standardized test procedures are lacking and must be established. This study demonstrated a combined experimental and numerical method to investigate the residual stresses from one of the most common encapsulation materials, silicone rubber (polydimethylsiloxane-PDMS) during the coating process at elevated temperatures. Measured shrinkage of test specimen correlates well to a modified shrinkage model using thermal-mechanical finite element method (FEM) simulation. All simulated interfacial stresses show stress concentration at the PDMS coating front depending on curing temperature and coating thickness, while Griffith's condition estimated the delamination of the coating front. This study emphasizes the understanding of the interfacial delamination giving the possibility to predict failure mode of neural interface.
Keywords: adhesion; delamination; neural electrodes; neural implant; polydimethylsiloxane-PDMS; residual stresses; shrinkage.