A Novel Preparation of Ag Agglomerates Paste with Unique Sintering Behavior at Low Temperature

Junlong Li; Yang Xu; Ying Meng; Zhen Yin; Xuelong Zhao; Yinghui Wang; Tadatomo Suga

doi:10.3390/mi12050521

A Novel Preparation of Ag Agglomerates Paste with Unique Sintering Behavior at Low Temperature

Micromachines (Basel). 2021 May 6;12(5):521. doi: 10.3390/mi12050521.

Authors

Junlong Li^{1

2

3}, Yang Xu^{1

2}, Ying Meng^{1

2

3}, Zhen Yin^{1

2

3}, Xuelong Zhao^{1

2

3}, Yinghui Wang^{1

2}, Tadatomo Suga⁴

Affiliations

¹ Institute of Microelectronics of Chinese Academy of Sciences, Beijing 100029, China.
² University of Chinese Academy of Sciences, Beijing 100049, China.
³ Institute of Microelectronic Technology of Kunshan, Suzhou 215347, China.
⁴ Collaborative Research Center, Meisei University, Hino-shi, Tokyo 191-8506, Japan.

Abstract

A novel bonding process using Ag agglomerates paste prepared by Ag₂O reduction has been proposed, which solved the problem of Cu substrate oxidation in the conventional Ag₂O sintering process for Cu-Cu bonding. By applying the Ag agglomerate paste to Ag-Ag bonding, a shear strength of 28.3 MPa at 150 °C was obtained. Further studies showed that the optimum sintering temperature was at 225 °C, and a shear strength of 46.4 MPa was obtained. In addition, a shear strength of 20 MPa was obtained at 225 °C for Cu-Cu bonding. Compared to common Ag pastes, the results in this paper revealed that the sintering behavior of Ag agglomerates was unique, and the sintering mechanisms for Ag-Ag and Cu-Cu bonding were also discussed.

Keywords: Ag agglomerates; Pt-catalyzed formic acid; low temperature; sintering.

Abstract

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