Roll-to-roll extrusion coated films were bonded onto polymer parts by back injection molding (BIM). The polypropylene (PP) coated polyethylene terephthalate (PET) films were pre-patterned with microstructured V-shaped grooves with 3.2 µm and 53 µm width, and other geometries. Bonding on PET and poly(methyl methacrylate) (PMMA) parts was facilitated by either higher tool or melt temperatures but was particularly enhanced by applying a mild oxygen plasma to the backside of the PET film prior to injection of the polymer melt. Silver wires from conductive nanoparticle ink were embedded into the PP coating during the BIM process by controlled collapse of the V-grooves. Thus, the feasibility of combining standard carrier film materials for printed flexible electronics and packaging into a non-flat polymer part was demonstrated, which could be a helpful step towards the fabrication of polymer parts with surface functionality.
Keywords: back injection molding; conductive nanoparticle ink; printed flexible electronics; roll-to-roll extrusion coating; thermal bonding.