The subject of healing and repair of damaged microelectrodes has become of particular interest as the use of integrated circuits, energy storage technologies, and sensors within modern devices has increased. As the dimensions of the electrodes shrink together with miniaturization of all the elements in modern electronic devices, there is a greater risk of mechanical-, thermal-, or chemical-induced fracture of the electrodes. In this research, a novel method of electrode healing using electrokinetically assembled carbon nanotube (CNT) bridges is presented. Utilizing the previously described step-wise CNT deposition process, conductive bridges were assembled across ever-larger electrode gaps, with the width of electrode gaps ranging from 20 microns to well over 170 microns. This work represents a significant milestone since the longest electrically conductive CNT bridge previously reported had a length of 75 microns. To secure the created conductive CNT bridges, they are fixed with a layer of electrodeposited polypyrrole (a conductive polymer). The resistance of the resulting CNT bridges, and its dependence on the size of the electrode gap, is evaluated and explained. Connecting electrodes via conductive CNT bridges can find many applications from nanoelectronics to neuroscience and tissue engineering.
Keywords: CNT; dielectrophoresis; electrokinetic assembly; electrokinetic healing of electrodes.