A System in Package Based on a Piezoelectric Micromachined Ultrasonic Transducer Matrix for Ranging Applications

Alexandre Robichaud; Dominic Deslandes; Paul-Vahé Cicek; Frederic Nabki

doi:10.3390/s21082590

A System in Package Based on a Piezoelectric Micromachined Ultrasonic Transducer Matrix for Ranging Applications

Sensors (Basel). 2021 Apr 7;21(8):2590. doi: 10.3390/s21082590.

Authors

Alexandre Robichaud¹, Dominic Deslandes², Paul-Vahé Cicek³, Frederic Nabki²

Affiliations

¹ Department of Applied Sciences, Université du Québec à Chicoutimi (UQAC), Chicoutimi, QC G7H 2B1, Canada.
² Department of Electrical Engineering, École de Technologie Supérieure (ETS), Montreal, QC H3C 1K3, Canada.
³ Department of Computer Sciences, Université du Québec à Montréal (UQAM), Montreal, QC H2X 3Y7, Canada.

Abstract

This paper proposes a system in package (SiP) for ultrasonic ranging composed of a 4 × 8 matrix of piezoelectric micromachined ultrasonic transducers (PMUT) and an interface integrated circuit (IC). The PMUT matrix is fabricated using the PiezoMUMPS process and the IC is implemented in the AMS 0.35 µm technology. Simulation results for the PMUT are compared to the measurement results, and an equivalent circuit has been derived to allow a better approximation of the load of the PMUT on the IC. The control circuit is composed of a high-voltage pulser to drive the PMUT for transmission and of a transimpedance amplifier to amplify the received echo. The working frequency of the system is 1.5 MHz.

Keywords: high voltage pulser; piezoelectric micromachined ultrasonic transducers (PMUT); regulated cascode (RGC); transimpedance amplifier (TIA).