To pave the way for InGaN-on-Si integrated photovoltaics, uniform and close-packed n-GaN/(Al)InGaN/p-GaN nanowire (NW) arrays with a ∼0.29 μm thick absorption segment of ∼2.35 eV energy bandgap were fabricated on a Si substrate using Ti-mask selective area growth (SAG) in a molecular beam epitaxy (MBE) chamber. Instead of using thick and insulting buffer layers, this SAG process was realized by employing a 3 nm AlN/GaN: Ge buffer layer to facilitate electrical and thermal conduction between NWs and Si. Scanning transmission electron microscopy and high-resolution electron energy loss spectroscopy mapping revealed the discontinuities of AlN and the embedments of GaN:Ge which contribute to a negligible resistance of the NWs-on-Si interface. AlInGaN active segment exhibits core-shell structures, which suppress nonradiative surface recombination at NW surfaces. Working of AlInGaN core-shell NW solar cells was demonstrated with improved open-circuit voltage (Voc) and higher energy conversion efficiency (η) than those reported for InGaN NW solar cells. Stable output characteristics including the Voc of 1.41 V and η of 2.46% were obtained under 30-Sun illuminations. Such NWs-on-Si devices use Si substrate as the bottom electrode. With a low series resistance of ∼1 Ω, this work paves the way to monolithically integrate MBE-SAG III-nitride devices and Si-based electronics, such as Si solar cells and CMOS devices.