Elevated Temperature Tensile Creep Behavior of Aluminum Borate Whisker-Reinforced Aluminum Alloy Composites (ABOw/Al-12Si)

Materials (Basel). 2021 Mar 4;14(5):1217. doi: 10.3390/ma14051217.

Abstract

In order to evaluate the elevated temperature creep performance of the ABOw/Al-12Si composite as a prospective piston crown material, the tensile creep behaviors and creep fracture mechanisms have been investigated in the temperatures range from 250 to 400 °C and the stress range from 50 to 230 MPa using a uniaxial tensile creep test. The creep experimental data can be explained by the creep constitutive equation with stress exponents of 4.03-6.02 and an apparent activation energy of 148.75 kJ/mol. The creep resistance of the ABOw/Al-12Si composite is immensely improved by three orders of magnitude, compared with the unreinforced alloy. The analysis of the ABOw/Al-12Si composite creep data revealed that dislocation climb is the main creep deformation mechanism. The values of the threshold stresses are 37.41, 25.85, and 17.36 at elevated temperatures of 300, 350 and 400 °C, respectively. A load transfer model was introduced to interpret the effect of whiskers on the creep rate of this composite. The creep test data are very close to the predicted values of the model. Finally, the fractographs of the specimens were analyzed by Scanning Electron Microscope (SEM), the fracture mechanisms of the composites at different temperatures were investigated. The results showed that the fracture characteristic of the ABOw/Al-12Si composite exhibited a macroscale brittle feature range from 300 to 400 °C, but a microscopically ductile fracture was observed at 400 °C. Additionally, at a low tensile creep temperature (300 °C), the plastic flow capacity of the matrix was poor, and the whisker was easy to crack and fracture. However, during tensile creep at a higher temperature (400 °C), the matrix was so softened that the whiskers were easily pulled out and interfacial debonding appeared.

Keywords: Al18B4O33 whisker-reinforced Al–12Si composite; creep behavior; creep fracture; load transfer; stress exponent.