Back-side-on-BOX heterogeneously integrated III-V-on-silicon O-band discrete-mode lasers

Opt Express. 2020 Dec 21;28(26):38579-38591. doi: 10.1364/OE.412839.

Abstract

We demonstrate foundry-fabricated O-band III-V-on-silicon discrete-mode lasers. The laser fabrication follows the back-side-on-buried-oxide laser integration process and is compatible with complex, multilayer, silicon-on-insulator based platforms. A series of devices were characterized, with the best devices producing on-chip powers of nearly 20 mW with Lorentzian linewidths below 20 kHz and a side mode suppression ratio of at least 60 dB.