Tensile Deformation Behavior of Typical Porous Laminate Structure at Different Temperatures

Materials (Basel). 2020 Nov 26;13(23):5369. doi: 10.3390/ma13235369.

Abstract

In this study, the Ni-Cr-W superalloy GH3230 is used as the test material. According to the actual structure of the flame tube, a porous laminate structure specimen is designed. The structure consists of impact holes, overflow holes and pin fins. High-temperature tensile tests at 650 °C, 750 °C and 850 °C were carried out to study the high-temperature mechanical properties and fracture mechanism of the specimens of porous laminate structure, and the strain nephogram of the specimens were obtained by digital image correlation (DIC) technique. Due to the large number and dense arrangement of overflow holes, an obvious hole interference effect can be found from the strain nephogram. The stress concentration around the pore and the interference between the pores provide priority places and paths for the initiation and propagation of microcracks. The test found that the microcracks of the porous laminate structure first occurred around the hole, the overflow surface fractured first, after which the impact surface fractured. The strength of the alloy exhibits a significant temperature sensitivity to temperature. From 650 °C to 750 °C, the ultimate strength (σb) and yield strength (σ0.2) decrease slightly, but they decrease significantly at 850 °C. The microstructure of the fracture surface shows that all microcracks occur at the interface between the matrix and the carbides but that the fracture mode of the specimens gradually changes from intergranular fracture to transgranular fracture as the temperature increases. Due to the pinning effect of the intracrystalline diffusive solute atoms on the dislocations, the stress-strain curves of the high-temperature tensile tests at 650 °C and 750 °C showed zigzag characteristic fluctuations during the strengthening stage.

Keywords: Ni-Cr-W superalloy; digital image correlation technology; fracture mechanism; microstructure.