On-chip metalenses based on one-dimensional gradient trench in the broadband visible

Opt Lett. 2020 Oct 15;45(20):5640-5643. doi: 10.1364/OL.405446.

Abstract

Metasurfaces are composed of flat, ultrathin subwavelength nanoantennas with strong capability in manipulating light propagation by modulations on its phase, amplitude, and polarization. For instance, the invention of two-dimensional (2D) metalenses has enabled light focusing and imaging in three-dimensional (3D) free space with miniaturized thickness and device size at a planar surface. However, such inherent form of 2D arrays and focusing functionality at 3D optical free-space limits the degree of freedom for light propagation and manipulation along a 2D planar surface and eventually the possibility of on-chip photonic system integration. Here, we theoretically study and demonstrate a new type of planar on-chip metalens, which enables light focusing and strong localization at a 2D surface. The planar on-chip architecture design is based on the one-dimensional (1D) length or width gradient trench metalens (GTM), which could yield the elaborately engineered phase shift for propagating light within the on-chip waveguide at the visible wavelength of 500 nm. By generating 1D phase arrangement at the nanoscale, a miniature on-chip metalens with ∼3×0.5µm dimension could achieve light focusing on a 2D waveguide surface with the flexibility to design scalable focal lengths and ultra-high numerical aperture of up to ∼0.99. Additionally, GTM metalens designs could also exhibit overlapped high depth-of-focus, which consequently could behave as achromatic-like lensing at the selected focal plane. Furthermore, we manifest that the focusing functionality can also be subject to dynamically tuning and switching on-and-off with TE/TM polarization change or waveguide index alteration. We believe this new form of on-chip 1D metalens holds potential applications including on-chip light manipulation functionality of focusing and diverging, optical on-chip sensing, next-generation on-chip optical communication, signal processing as well as imaging devices, etc.