The effects of the presence of amalgam on titanium (Ti) dissolution in the oral environment under acidic, neutral, and basic conditions was studied. The presence of amalgam was found to suppress Ti release under acidic conditions due to the redeposition of TiOx/SnOx on the surface of the Ti. The redeposition of SnOx was due to the amalgam releasing its components (Hg, Cu, Sn, Ag) and the thermodynamic preference of Sn to oxidize, which was confirmed using mass measurements, ICP-MS analyses, and X-ray Photoelectron Spectroscopy (XPS). XPS depth profiling was performed to characterize the composition and oxidation states of the redeposited SnOx/TiOx film. Under basic conditions, the amalgam hindered Ti dissolution, but no redeposition of amalgam components was observed for the Ti.
Keywords: ICP-MS; XPS; amalgam; corrosion; galvanic; titanium.