In this study, to control the formation of non-uniformly distributed large voids and Cu-Sn alloy agglomeration, which leads to local compositional misfit and secondary phase formation, a SnS compound precursor was applied instead of metal Sn to avoid compositional non-uniformity. Using a Cu/Zn/SnS stacked precursor, a temperature tracking experiment was conducted to confirm the formation controllability of the void and the secondary phase. According to the results of this temperature-profile tracking experiment, it was confirmed that the large void was successfully controlled; however, an additional ZnSSe secondary phase layer was formed in the middle of the CZTSSe upper layer and small voids were distributed relatively uniformly in the bottom CZTSSe layer. An efficiency of approximately 8% was obtained when the Cu/Zn/SnS stacked precursor was used. The origins of the low short-circuit current and fill factor are posited to be caused by the increase of the energy bandgap of the CZTSSe layer due to the SnS precursor, the thin top CZTSSe layer (around 600 nm) of the triple CZTSSe layer, and the diffusion length extension of the minor carriers caused by bypassing the ZnSSe phase.
Keywords: CZTSSe; SnS; formation mechanism; two-step process; void.