The present study focuses on maintaining the temperature magnitude around heat-sensitive components (cloaked region) in advanced electronic devices by introducing convective elements using extended surface fins. A finite element analysis confirmed that with the aid of the convection component to thermal cloaking, heat flux can be redirected around the cloaked region as well as control the temperature. The simulation results were verified by experiment under natural convection corresponding to the simulation assumptions. It was found that when the heat source maintains its temperature at 100 °C and the heat sink remains at 0 °C, the temperature within the cloaked region can reduce by up to 15 °C, from ~ 50 °C with conventional cloaking to 35 °C with a well-designed array of surface fins. It is worth noting that experimental results are consistent with the simulation results.