Deposition of Durable Micro Copper Patterns into Glass by Combining Laser-Induced Backside Wet Etching and Laser-Induced Chemical Liquid Phase Deposition Methods

Jae Min Seo; Kui-Kam Kwon; Ki Young Song; Chong Nam Chu; Sung-Hoon Ahn

doi:10.3390/ma13132977

Deposition of Durable Micro Copper Patterns into Glass by Combining Laser-Induced Backside Wet Etching and Laser-Induced Chemical Liquid Phase Deposition Methods

Materials (Basel). 2020 Jul 3;13(13):2977. doi: 10.3390/ma13132977.

Authors

Jae Min Seo¹, Kui-Kam Kwon¹, Ki Young Song², Chong Nam Chu¹, Sung-Hoon Ahn¹

Affiliations

¹ Department of Mechanical & Aerospace Engineering, Seoul National University, 1, Kwanak-ro, Kwanak-gu, Seoul 08826, Korea.
² School of Mechanical Engineering, Soongsil University, 369, Sangdo-ro, Dongjak-gu, Seoul 06978, Korea.

Abstract

Glass is a well-known non-conductive material that has many useful properties, and considerable research has been conducted into making circuits on glass. Many deposition techniques have been studied, and laser-induced chemical liquid phase deposition (LCLD) is a well-known and cost-effective method for rapid prototyping of copper deposition on glass. However, the deposition results from the LCLD method on the surface of glass, which shows an issue in its detachment from the substrates because of the relatively low adhesion between deposited copper and the nontreated glass surface. This problem undermines the usability of deposited glass in industrial applications. In this study, the laser-induced backside wet etching (LIBWE) method was performed as a preceding process to fabricate microchannels, which were filled with copper by LCLD. Additional durable copper wire was produced as a result of the enhanced adhesion between the glass and the deposited copper. The adhesion was enhanced by a rough surface and metal layer, which are characteristics of LIBWE machining. Furthermore, the proposed method is expected to broaden the use of deposited glass in industrial applications, such as in stacked or covered multilayer structures with built-in copper wires, because the inserted copper can be physically protected by the microstructures.

Keywords: additive machining; anchor effect; embedded metallic patterns on glass; laser induced chemical liquid phase deposition; laser-induced backside wet etching.