1 Institute of Physics, Chinese Academy of Sciences, 100190, Beijing, China.
2 Songshan Lake Materials Laboratory, 523808, Dongguan, China.
3 Department of Physics and Beijing Key Laboratory of Optoelectronic Functional Materials & Micro-Nano Devices, Renmin University of China, 100872, Beijing, China.
4 School of Materials Science and Engineering, Ulsan National Institute of Science and Technology (UNIST), Ulsan, 44919, Republic of Korea.
5 School of Information and Electronics, MIIT Key Laboratory for Low-Dimensional Quantum Structure and Devices, Beijing Institute of Technology, 100081, Beijing, China.
6 College of Engineering, Peking University, 100871, Beijing, China.
7 School of Physical Science and Technology, Shanghai Tech University, 201210, Shanghai, China.
8 University of Chinese Academy of Sciences, 100049, Beijing, China.
9 Institute of Microelectronics of Chinese Academy of Sciences, 100029, Beijing, China.
10 Department of Mechanical and Materials Engineering, University of Nebraska-Lincoln, Lincoln, NE, 68588, United States.
11 Department of Electrical and Computer Engineering, University of Nebraska-Lincoln, Lincoln, NE, 68588, United States. psutter@unl.edu.
12 Songshan Lake Materials Laboratory, 523808, Dongguan, China. wji@ruc.edu.cn.
13 Institute of Physics, Chinese Academy of Sciences, 100190, Beijing, China. xjzhou@iphy.ac.cn.
14 Songshan Lake Materials Laboratory, 523808, Dongguan, China. xjzhou@iphy.ac.cn.
15 University of Chinese Academy of Sciences, 100049, Beijing, China. xjzhou@iphy.ac.cn.
16 Institute of Physics, Chinese Academy of Sciences, 100190, Beijing, China. hjgao@iphy.ac.cn.
17 University of Chinese Academy of Sciences, 100049, Beijing, China. hjgao@iphy.ac.cn.