Optimization and Quality Evaluation of the Interlayer Bonding Performance of Additively Manufactured Polymer Structures

Polymers (Basel). 2020 May 19;12(5):1166. doi: 10.3390/polym12051166.

Abstract

The application of additive manufacturing changes from prototypes to series production. In order to fulfill all requirements of series production, the process and the material characteristics must be known. The machine operator of additive manufacturing systems is both a component and a material producer. Nevertheless, there is no standardized procedure for the manufacturing or testing of such materials. This includes the high degree of anisotropy of additively manufactured polymers via material extrusion. The interlayer bonding performance between two layers in the manufacturing direction z is the obvious weakness that needs to be improved. By optimizing this interlayer contact zone, the overall performance of the additively manufactured polymer is increased. This was achieved by process modification with an infrared preheating system (IPS) to keep the temperature of the interlayer contact zone above the glass transition temperature during the manufacturing process. Combining destructive and non-destructive testing methods, the process modification IPS was determined and evaluated by a systematic approach for characterizing the interlayer bonding performance. Thereby, tensile tests under quasi-static and cyclic loading were carried out on short carbon fiber-reinforced polyamide (SCFRP). In addition, micro-computed tomography and microscopic investigations were used to determine the process quality. The IPS increases the ultimate interlayer tensile strength by approx. 15% and shows a tendency to significantly improved the fatigue properties. Simultaneously, the analysis of the micro-computed tomography data shows a homogenization of the void distribution by using the IPS.

Keywords: additively manufactured polymer structures; computed tomography; infrared preheating; interlayer tensile strength; material extrusion; void distribution.