Decade of 2D-materials-based RRAM devices: a review

Abstract

Two dimensional (2D) materials have offered unique electrical, chemical, mechanical and physical properties over the past decade owing to their ultrathin, flexible, and multilayer structure. These layered materials are being used in numerous electronic devices for various applications, and this review will specifically focus on the resistive random access memories (RRAMs) based on 2D materials and their nanocomposites. This study presents the device structures, conduction mechanisms, resistive switching properties, fabrication technologies, challenges and future aspects of 2D-materials-based RRAMs. Graphene, derivatives of graphene and MoS₂ have been the major contributors among 2D materials for the application of RRAMs; however, other members of this family such as hBN, MoSe₂, WS₂ and WSe₂ have also been inspected more recently as the functional materials of nonvolatile RRAM devices. Conduction in these devices is usually dominated by either the penetration of metallic ions or migration of intrinsic species. Most prominent advantages offered by RRAM devices based on 2D materials include fast switching speed (<10 ns), less power losses (10 pJ), lower threshold voltage (<1 V) long retention time (>10 years), high electrical endurance (>10⁸ voltage cycles) and extended mechanical robustness (500 bending cycles). Resistive switching properties of 2D materials have been further enhanced by blending them with metallic nanoparticles, organic polymers and inorganic semiconductors in various forms.

Keywords: 105 Low-Dimension (1D/2D) materials; 201 Electronics / Semiconductor / TCOs; 2D materials; 306 Thin film / Coatings; 503 TEM; Memory devices; RRAMs; SEM; STEM; bipolar & unipolar; fabrication technology; nonvolatile; planar & sandwiched structure; resistive switching.