Synthesis of Superheat-Resistant Polyimides with Enhanced Dielectric Constant by Introduction of Cu(ΙΙ)-Coordination

Guangtao Qian; Mengjie Hu; Shangying Zhang; Mengxia Wang; Chunhai Chen; Jianan Yao

doi:10.3390/polym12020442

Synthesis of Superheat-Resistant Polyimides with Enhanced Dielectric Constant by Introduction of Cu(ΙΙ)-Coordination

Polymers (Basel). 2020 Feb 13;12(2):442. doi: 10.3390/polym12020442.

Authors

Guangtao Qian¹, Mengjie Hu¹, Shangying Zhang¹, Mengxia Wang¹, Chunhai Chen¹, Jianan Yao¹

Affiliation

¹ Center for Advanced Low-Dimension Materials, State Key Laboratory for Modification of Chemical Fibers and Polymer Materials, College of Material Science and Engineering, Donghua University, Shanghai 201620, China.

Abstract

To achieve polyimide-metal complexes with enhanced properties, 5-amine-2-(5-aminopyridin-2-yl)-1-methyl-benzimidazole (PyMePABZ) that contains stiff 2-(2'-pyridyl)benzimidazole (PyBI) was synthesized and exploited to construct the Cu(ΙΙ)-crosslinked polyimides (Cu-PIs). These Cu-PIs exhibited higher dielectric, thermal, and mechanical properties with an increase in Cu²⁺ content. Among them, their dielectric constants (ε_rS) were up to 43% superior to that of the neat PI, glass transition temperatures (T_gs) were all over 400 °C, and 5% weight loss temperature (T_5%) maintained beyond 500 °C. These data indicate that the metal coordination crosslinking provided a useful guide to develop high performance PIs which possess potential application as useful high temperature capacitors.

Keywords: high performance; metal coordination crosslinking; polyimide.