The production of electrodes and sensors using plastic substrates has increased substantially for the last decades. Although devices are fabricated using plastic substrates suitable for the purpose of each device, it is difficult to find a process that can be used commonly for most types of plastics. In this paper, two kinds of electrode fabrication process that can be applied to most plastic films using kapton double sided tape and gold leaf are proposed. One is for the plastic film with adhesive and the other is for the film without adhesive. First, the kapton double-sided tape was patterned using a CO2 laser. After transfer double-sided tape to desired substrate, release paper was detached and gold leaf was attached on the exposed side of the tape. Then, the tape was appropriately removed according to the presence or absence of the adhesive. After that, the packaging was performed using an adhesive when the used film has adhesive, and otherwise, heat press was used for packaging. These processes have a variety of advantages such as inexpensive, fast-running and commonly applicable to many plastics. To prove its usability, impedance and minimum line width was measured.