This paper reports on the design and fabrication of a ${48} \times {48}$48×48 full-color pixelated addressable light-emitting diode on silicon (LEDoS) micro display. The metallization pattern was designed and fabricated on a silicon substrate, while red, green, and blue monochromatic micro LEDs were integrated on the silicon substrate using transfer printing. The red, green, and blue micro LEDs are flip-chip structures in which red micro LEDs were fabricated using substrate transfer, mesa etching, metal deposition, and chip dicing. The integration process does not require wire bonding, which reduces the full-color pixel size and increases the integration speed. The LEDoS micro display can be addressed individually for each LED pixel and display representative patterns.