Chemical bonds in intercalation compounds CuxTiCh2 (Ch = S, Te)

A S Shkvarin; A I Merentsov; N Tsud; A N Titov

doi:10.1063/1.5128299

Chemical bonds in intercalation compounds Cu_xTiCh₂ (Ch = S, Te)

J Chem Phys. 2019 Dec 21;151(23):234701. doi: 10.1063/1.5128299.

Authors

A S Shkvarin¹, A I Merentsov¹, N Tsud², A N Titov¹

Affiliations

¹ M. N. Miheev Institute of Metal Physics, Ural Branch of Russian Academy of Sciences, 620137 Ekaterinburg, Russia.
² Faculty of Mathematics and Physics, Department of Surface and Plasma Science, Charles University, V Holešovičkách 2, 18000 Prague, Czech Republic.

PMID: 31864255
DOI: 10.1063/1.5128299

Abstract

A thorough study of the chemical bonding between intercalated copper and host lattice TiCh₂ (Ch = S, Te) was performed. In order to separate the contributions of the copper, titanium, and chalcogen states into the electronic structure of the valence band, photoelectron spectroscopy in nonresonant and resonant (Cu 3p-3d and Ti 2p-3d) excitation modes was used. It is shown that the ionicity of the chemical bond between copper and host lattice is decreased in the TiS₂ → TiSe₂ → TiTe₂ row. In Cu_xTiS₂, copper atoms form the chemical bond with TiCh₂ host lattice, while in Cu_xTiTe₂ directly with tellurium atoms.