Effect of static magnetic field on mold corrosion of printed circuit boards

Jirui Wang; Ziheng Bai; Kui Xiao; Xueming Li; Qianqian Liu; Xuan Liu; Junsheng Wu; Lin Lu; Chaofang Dong

doi:10.1016/j.bioelechem.2019.107394

Effect of static magnetic field on mold corrosion of printed circuit boards

Bioelectrochemistry. 2020 Feb:131:107394. doi: 10.1016/j.bioelechem.2019.107394. Epub 2019 Sep 13.

Authors

Jirui Wang¹, Ziheng Bai¹, Kui Xiao², Xueming Li¹, Qianqian Liu¹, Xuan Liu¹, Junsheng Wu¹, Lin Lu¹, Chaofang Dong¹

Affiliations

¹ Corrosion and Protection Center, Institute of Advanced Materials and Technology, University of Science and Technology Beijing, Beijing 100083, PR China; National Materials Corrosion and Protection Data Center, University of Science and Technology Beijing, Beijing 100083, PR China.
² Corrosion and Protection Center, Institute of Advanced Materials and Technology, University of Science and Technology Beijing, Beijing 100083, PR China; National Materials Corrosion and Protection Data Center, University of Science and Technology Beijing, Beijing 100083, PR China. Electronic address: xiaokui@ustb.edu.cn.

PMID: 31710892
DOI: 10.1016/j.bioelechem.2019.107394

Abstract

Mold has a strong impact on the corrosion behavior of metals, especially under environmental conditions conducive to mold growth. However, the magnetic fields generated by electronic devices have effects on the metal corrosion and mold growth. In this study, a 10 mT static magnetic field (SMF) perpendicular to the surface of samples was applied to study the corrosion of a copper-clad printed circuit board (PCB-Cu) by mold under the SMF. Based on the analysis of the corrosion morphology of the PCB-Cu after a test in the atmosphere and the composition of the corrosion products, the corrosion behavior of mold on the PCB-Cu in the presence or absence of the SMF was revealed. In the absence of a magnetic field, mold formed a spore-centered corrosion pit group on the surface of the PCB-Cu, which was macroscopically characterized by regional uniform corrosion. When a 10 mT SMF was applied, the magnetic field exhibited an inhibitory effect on the growth of mold, which was hindered, and the corrosion of the PCB-Cu surface slowed down.

Keywords: Copper-clad plate; Corrosion mechanism; Magnetic field; Mold, corrosion.

MeSH terms

Aspergillus niger / metabolism*
Corrosion
Electronics*
Fungi*
Magnetics*