Highly foldable conducting interconnects are fundamental elements for multipurpose flexible electronic circuits, including wearable electronics and biomedical devices. Traditional metalized thin-film interconnects demonstrate stable electronic performances in rigid devices but low deformation tolerance in flexibility. Recently, several remarkable research studies on flexible electronics have been carried out, as interconnect structures of serpentine, wavy, and nanowire networks. However, all of the reported flexible interconnects possess either mechanical instability or fabrication difficulty, which restrict their practical applications. Here, we report a new flexible circuit system, which consists of nanowave structure metal interconnects with highly foldable and large-scale manufactured features. This kind of nanowave interconnects presents both stable and prominent electrical performances under mechanical deformation (down to 0.2 mm bending radius with interconnecting resistance variation less than 10%). Further, a highly flexible paper-like wireless accelerometer based on the nanowave interconnects is fabricated and characterized under several extreme strain situations. Our approach affords a comprehensive direction for constitutional realization of new flexible designs and implements the assembly of next-generation foldable electronic equipment.
Keywords: flexible circuits; foldable electronics; high stability; large curvature; nanowave electrodes.