High rate laser deposition of conductive copper microstructures from deep eutectic solvents

Andrey Shishov; Dmitry Gordeychuk; Lev Logunov; Ilya Tumkin

doi:10.1039/c9cc05184h

High rate laser deposition of conductive copper microstructures from deep eutectic solvents

Chem Commun (Camb). 2019 Aug 21;55(65):9626-9628. doi: 10.1039/c9cc05184h. Epub 2019 Jul 26.

Authors

Andrey Shishov¹, Dmitry Gordeychuk¹, Lev Logunov¹, Ilya Tumkin¹

Affiliation

¹ Institute of Chemistry, Saint-Petersburg University, Saint Petersburg State University, SPbSU, SPbU, 7/9 Universitetskaya nab., St. Petersburg 199034, Russia. andrey.shishov.rus@gmail.com.

PMID: 31347628
DOI: 10.1039/c9cc05184h

Abstract

In this communication, the phenomenon of the laser chemical deposition of copper using deep eutectic solvents (DESs) on a dielectric substrate has been shown for the first time. The use of eutectic solvents made it possible to greatly simplify the procedure of metal deposition and increase the deposition rate by more than 150 times compared to the use of aqueous solutions.