Curing and Characteristics of N,N,N',N'-Tetraepoxypropyl-4,4'-Diaminodiphenylmethane Epoxy Resin-Based Buoyancy Material

Sizhu Yu; Xiaodong Li; Xiaoyan Guo; Zhiren Li; Meishuai Zou

doi:10.3390/polym11071137

Curing and Characteristics of N,N,N',N'-Tetraepoxypropyl-4,4'-Diaminodiphenylmethane Epoxy Resin-Based Buoyancy Material

Polymers (Basel). 2019 Jul 3;11(7):1137. doi: 10.3390/polym11071137.

Authors

Sizhu Yu¹, Xiaodong Li², Xiaoyan Guo¹, Zhiren Li¹, Meishuai Zou³

Affiliations

¹ School of Materials Science and Engineering, Beijing Institute of Technology, Beijing 100081, China.
² School of Materials Science and Engineering, Beijing Institute of Technology, Beijing 100081, China. bitlxd@bit.edu.cn.
³ School of Materials Science and Engineering, Beijing Institute of Technology, Beijing 100081, China. zoums@bit.edu.cn.

Abstract

Buoyancy material is a type of low-density and high-strength composite material which can provide sufficient buoyancy with deep submersibles. A new buoyancy material with N,N,N',N'-tetraepoxypropyl-4,4'-diaminodiphenylmethane epoxy resin (AG-80) and m-xylylenediamine (m-XDA) curing agent as matrix and hollow glass microsphere (HGM) as the filler is prepared. The temperature and time of the curing process were determined by the calculations of thermal analysis kinetics (TAK) through differential scanning calorimetry (DSC) analysis. The results show that the better mass ratio of AG-80 with m-XDA is 100/26. Combined TAK calculations and experimental results lead to the following curing process: pre-curing at 75 °C for 2 h, curing at 90 °C for 2 h, and post-curing at 100 °C for 2 h. The bulk density, compressive strength, and saturated water absorption of AG-80 epoxy resin-based buoyancy material were 0.729 g/cm³, 108.78 MPa, and 1.23%, respectively. Moreover, this type of buoyancy material can resist the temperature of 250 °C.

Keywords: DSC; buoyancy material; epoxy resin; thermal analysis kinetics.