Infrared Brazed Joints of Ti50Ni50 Shape Memory Alloy and Ti-15-3 Alloy Using Two Ag-Based Fillers

Abstract

The wettability, microstructures, and bonding strength of infrared brazing Ti-15-3 and Ti₅₀Ni₅₀ shape memory alloy using 72Ag-28Cu (wt.%) and 68.8Ag-26.7Cu-4.5Ti (wt.%) filler metals have been investigated. Only Ticusil^® active braze readily wets both Ti₅₀Ni₅₀ and Ti-15-3 substrates. Wetting of eutectic 72Ag-28Cu melt on Ti₅₀Ni₅₀ base metal is greatly ameliorated by adding 4.5 wt.% Ti into the alloy. The brazed Ti-15-3/BAg-8/Ti₅₀Ni₅₀ joint consists of Cu-Ti intermetallics in the Ag-rich matrix. The formation of interfacial Cu(Ti,V) and (Cu_xNi_1-x)₂Ti intermetallics next to Ti-15-3 and Ti₅₀Ni₅₀ substrates, respectively, is attributed to the wetting of both substrates. The brazed Ti-15-3/Ticusil^®/Ti₅₀Ni₅₀ joint shows a vigorous reaction, which results in the formation of a large amount of Ti₂Ni intermetallics in the joint. The maximum joint strengths using BAg-8 and Ticusil^® filler metals are 197 MPa and 230 MPa, respectively.

Keywords: Ti-15-3 alloy; Ti50Ni50 shape memory alloy; brazing; interfacial reaction; joint strength.