Low-Dissipation Thermosets Derived from Oligo(2,6-Dimethyl Phenylene Oxide)-Containing Benzoxazines

Chien-Han Chen; Kuan-Wei Lee; Ching-Hsuan Lin; Tzong-Yuan Juang

doi:10.3390/polym10040411

Low-Dissipation Thermosets Derived from Oligo(2,6-Dimethyl Phenylene Oxide)-Containing Benzoxazines

Polymers (Basel). 2018 Apr 7;10(4):411. doi: 10.3390/polym10040411.

Authors

Chien-Han Chen¹, Kuan-Wei Lee², Ching-Hsuan Lin³, Tzong-Yuan Juang⁴

Affiliations

¹ Department of Chemical Engineering, National Chung Hsing University, Taichung 402, Taiwan. jain6792002@gmail.com.
² Department of Chemical Engineering, National Chung Hsing University, Taichung 402, Taiwan. tgdyt547165@gmail.com.
³ Department of Chemical Engineering, National Chung Hsing University, Taichung 402, Taiwan. linch@nchu.edu.tw.
⁴ Department of Cosmeceutics, China Medical University, Taichung 404, Taiwan. tyjuang@mail.cmu.edu.tw.

Abstract

Poly(2,6-dimethyl phenyl oxide) (PPO) is known for its low dissipation factor. To achieve insulating materials with low dissipation factors for high-frequency communication applications, a telechelic oligomer-type benzoxazine (P-APPO) and a main-chain type benzoxazine polymer (BPA-APPO) were prepared from an amine end-capped oligo (2,6-dimethyl phenylene oxide) (APPO). The APPO was prepared from a nucleophilic substitution of a phenol-end capped oligo (2,6-dimethyl phenylene oxide) (a commercial product, SA 90) with fluoronitrobenzene, and followed by catalytic hydrogenation. After self-curing or curing with a dicyclopentadiene-phenol epoxy (HP 7200), thermosets with high-T_g and low-dissipation factor can be achieved. Furthermore, the resulting epoxy thermosets show better thermal and dielectric properties than those of epoxy thermoset cured from its precursor SA90, demonstrating it is a successful modification in simultaneously enhancing the thermal and dielectric properties.

Keywords: benzoxazine; low-dissipation; poly(phenyl oxide).