With developments of the electronics industry, more components are being included in electronic devices, which has led to challenges in thermal management. Using reduced graphene oxide embedded with MQ silicone resin (RGO/MQ) nano-aggregates as the composite filler and silicone rubber (SR) as the matrix, a simple approach is designed to prepare RGO/MQ/SR composites. Reduced graphene oxide (RGO) was first used as a substrate for the growth of MQ silicone resin by hybridization, forming sandwich-like micro structured RGO/MQ nano-aggregates successfully. Then, RGO/MQ was integrated into α,ω-dihydroxylpolydimethylsiloxane based on the in situ solvent-free blending method, followed by condensation and vulcanization, fabricating the final RGO/MQ/SR composites. The effective strategy could enhance the adaptability between graphene and silicone matrix under external stimuli at room temperature by embedding nanoscale MQ into the interface of graphene/silicone as the buffer layer. Obvious improvements were found in both thermal conductivity and mechanical properties due to excellent dispersion and interfacial compatibility of RGO/MQ in the host materials. These attractive results suggest that this RGO/MQ/SR composite has potential as a thermal interface material for heat dissipation applications.
Keywords: MQ silicone resin; mechanical properties; reduced graphene oxide; silicone rubber composites; thermal conductivity.