The choice of efficient antimicrobial additives for polyamide resins is very difficult because of their high processing temperatures of up to 300 °C. In this study, a new, thermally stable polymeric biocide, polyhexamethylene guanidine 2-naphtalenesulfonate (PHMG-NS), was synthesised. According to thermogravimetric analysis, PHMG-NS has a thermal degradation point of 357 °C, confirming its potential use in joint melt processing with polyamide resins. Polyamide 11 (PA-11) films containing 5, 7 and 10 wt% of PHMG-NS were prepared by compression molding and subsequently characterised by FTIR spectroscopy. The surface properties were evaluated both by contact angle, and contactless induction. The incorporation of 10 wt% of PHMG-NS into PA-11 films was found to increase the positive surface charge density by almost two orders of magnitude. PA-11/PHMG-NS composites were found to have a thermal decomposition point at about 400 °C. Mechanical testing showed no change of the tensile strength of polyamide films containing PHMG-NS up to 7 wt%. Antibiofilm activity against the opportunistic bacteria Staphylococcus aureus and Escherichia coli was demonstrated for films containing 7 or 10 wt% of PHMG-NS, through a local biocide effect possibly based on an influence on the bacterial eDNA. The biocide hardly leached from the PA-11 matrix into water, at a rate of less than 1% from its total content for 21 days.
Keywords: antibacterial; biofilm; polyamide 11; polymeric biocide; thermal stability.