In situ TEM mechanical characterization of one-dimensional nanostructures via a standard double-tilt holder compatible MEMS device

Yang Yang; Zhengqian Fu; Xiao Zhang; Yan Cui; Fangfang Xu; Tie Li; Yuelin Wang

doi:10.1016/j.ultramic.2018.12.008

In situ TEM mechanical characterization of one-dimensional nanostructures via a standard double-tilt holder compatible MEMS device

Ultramicroscopy. 2019 Mar:198:43-48. doi: 10.1016/j.ultramic.2018.12.008. Epub 2018 Dec 17.

Authors

Yang Yang¹, Zhengqian Fu², Xiao Zhang¹, Yan Cui³, Fangfang Xu⁴, Tie Li³, Yuelin Wang⁵

Affiliations

¹ Science and Technology on Microsystem Laboratory, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai 200050, China; University of Chinese Academy of Sciences (UCAS), Beijing 100049, China.
² State Key Laboratory of High Performance Ceramics and Superfine Microstructures, Shanghai Institute of Ceramics, Chinese Academy of Sciences, Shanghai 200050, China.
³ Science and Technology on Microsystem Laboratory, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai 200050, China.
⁴ State Key Laboratory of High Performance Ceramics and Superfine Microstructures, Shanghai Institute of Ceramics, Chinese Academy of Sciences, Shanghai 200050, China. Electronic address: ffxu@mail.sic.ac.cn.
⁵ Science and Technology on Microsystem Laboratory, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai 200050, China. Electronic address: ylwang@mail.sim.ac.cn.

PMID: 30641406
DOI: 10.1016/j.ultramic.2018.12.008

Abstract

This research is aimed at the development of an in situ tensile device which is suitable for standard double-tilt electrical TEM holders. The device contains a hexagonal electrostatic chip with a diameter of 1.8 mm. The chip has 706 pairs of combs, which provides an effective tensile displacement larger than 1 µm. To demonstrate the device performance, in situ tensile testing for penta-twinned silver nanowire is conducted in a high-resolution TEM. Experimental results show that the device can fulfill a tilt angle of 10° around both X and Y axes when performing in situ tensile testing experiments. The implemented tensile device has potential applications to characterize the deformation behavior of individual nanostructure in situ TEM at atomic lattice resolution level.

Keywords: Double-tilt; Mechanical characterization; Tensile testing; in situ TEM.

Publication types

Research Support, Non-U.S. Gov't