Electrically Conductive Adhesives and the Shingled Array Cell for High Density Modules

Hongsub Jee; Sooho Lee; Chaehwan Jeong; Jaehyeong Lee

doi:10.1166/jnn.2019.16200

Electrically Conductive Adhesives and the Shingled Array Cell for High Density Modules

J Nanosci Nanotechnol. 2019 Mar 1;19(3):1360-1363. doi: 10.1166/jnn.2019.16200.

Authors

Hongsub Jee¹, Sooho Lee², Chaehwan Jeong¹, Jaehyeong Lee²

Affiliations

¹ Applied Optics and Energy R&D Group, Korea Institute of Industrial Technology, Gwangju, 61012, South Korea.
² School of Electronic and Electrical Engineering, Sungkyunkwan Univ., Suwon, 16419, South Korea.

PMID: 30469188
DOI: 10.1166/jnn.2019.16200

Abstract

The shingled array of solar cells has the advantages of a larger active area and smaller current density than conventional solar cells. Because the power loss is mainly driven by the decrease in current density, this new method has the benefit of increasing module power with the same installed area as used in other methods. As the electrically conductive adhesive (ECA), CA3556HF was chosen and characterized by analysis of reflectance and sheet resistance. These analyzed data show consistent and relevant results for the cell efficiency of separated and serially connected cells fabricated by means of the shingled array method. We successfully demonstrated the increase of the high density module (HDM) power by 5.1% for a 30 cm×30 cm area and the fill factor also increased by 2% compared with conventional modules.

Publication types

Research Support, Non-U.S. Gov't