A one-dimensional analytic thermal model for the flexible electronic devices integrated with human skin under a constant and pulsed power is developed. The Fourier heat conduction equation is adopted for the flexible electronics devices while the Pennes bio-heat transfer equation is adopted for the skin tissue. Finite element analysis is performed to validate the analytic model through the comparison of temperature distributions in the system. The influences of geometric and loading parameters on the temperature increase under a pulsed power are investigated. It is shown that a small duty cycle can reduce the temperature increase of the system effectively. A thin substrate can reduce the device temperature but increase the skin surface temperature. The results presented may be helpful to optimize the design of flexible electronic devices to reduce the adverse thermal influences in bio-integrated applications.
Keywords: flexible electronics; human skin; thermal analysis.