Forced flow atomic layer deposition of TiO2 on vertically aligned Si wafer and polysulfone fiber: Design and efficacy of conduit plates and soak function

Mrinalini Mishra; Chia-Yen Chan; Chi-Chung Kei; Yin-Cheng Yen; Ming-Wei Liao; Tsong-Pyng Perng

doi:10.1063/1.5043476

Forced flow atomic layer deposition of TiO₂ on vertically aligned Si wafer and polysulfone fiber: Design and efficacy of conduit plates and soak function

Rev Sci Instrum. 2018 Oct;89(10):105108. doi: 10.1063/1.5043476.

Authors

Mrinalini Mishra¹, Chia-Yen Chan², Chi-Chung Kei², Yin-Cheng Yen¹, Ming-Wei Liao¹, Tsong-Pyng Perng¹

Affiliations

¹ Department of Materials Science and Engineering, National Tsing Hua University, Hsinchu 300, Taiwan.
² Instrument Technology Research Center, National Applied Research Laboratories, Hsinchu 300, Taiwan.

PMID: 30399828
DOI: 10.1063/1.5043476

Abstract

The effectiveness of three different designs of conduit plates was verified for even distribution of precursors in a voluminous forced-flow atomic layer deposition (ALD) chamber designed to hold macroscopic elongated substrates vertically. Furthermore, a new "soak function" was introduced in the controlling software of the ALD instrument. This function enabled increase in residence time of the precursor in the chamber without escalating the dosage. The flow of precursors guided by the conduit plates with and without application of the soak function was simulated using computational fluid dynamics. A conformal coating of TiO₂ with good uniformity on Si and porous polysulfone fibers was achieved to evidence the design and efficacy of conduit plates and soak function.