Copper powder has broad applications in the powder metallurgy, heat exchanger, and electronic industries due to its intrinsically high electrical and thermal conductivities. However, the ease of formation of surface oxide or patina layer raises difficulty of storage and handling of copper powder, particularly in the case of Cu microparticles. Here, we developed a thermal chemical vapor deposition chemical vapor deposition (CVD) process for large-scale synthesis of graphene coatings on Cu microparticles, which importantly can remain monodisperse without aggregation after graphene growth at high temperature by using removal spacers. Compared to other protective coating methods, the intrinsic electrical and thermal properties of Cu powder would not be degraded by uniform growth of low defect few-layer graphene on each particle surface. As a result, when the anticorrosion performance test was carried out by immersing the samples in Cu etchant, the corrosion rate of graphene/Cu microparticles was significantly improved (ca three times slower) compared to that of pristine Cu powder, also showing a comparable anticorrosion ability to commercial CuZn30 alloy.
Keywords: chemical vapor deposition (CVD) growth; corrosion resistance; graphene/Cu microparticles; monodisperse; removal spacers.