To guarantee the normal operation of next generation portable electronics and wearable devices, together with avoiding electromagnetic wave pollution, it is urgent to find a material possessing flexibility, ultrahigh conductive, and superb electromagnetic interference shielding effectiveness (EMI SE) simultaneously. In this work, inspired by a building bricks toy with the interlock system, we design and fabricate a copper/large flake size graphene (Cu/LG) composite thin film (≈8.8 μm) in the light of high temperature annealing of a large flake size graphene oxide film followed by magnetron sputtering of copper. The obtained Cu/LG thin-film shows ultrahigh thermal conductivity of over 1932.73 (±63.07) W m-1 K-1 and excellent electrical conductivity of 5.88 (±0.29) × 106 S m-1 . Significantly, it also exhibits a remarkably high EMI SE of over 52 dB at the frequency of 1-18 GHz. The largest EMI SE value of 63.29 dB, accorded at 1 GHz, is enough to obstruct and absorb 99.99995% of incident radiation. To the best of knowledge, this is the highest EMI SE performance reported so far in such thin thickness of graphene-based materials. These outstanding properties make Cu/LG film a promising alternative building block for power electronics, microprocessors, and flexible electronics.
Keywords: electrical conductivity; electromagnetic interference shielding; films; large flake size graphene; thermal conductivity.
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