Heat-controlled micropillar array device for microsystems technology

Soft Matter. 2017 Oct 18;13(40):7264-7272. doi: 10.1039/c7sm01480e.

Abstract

A new temperature-controlled smart soft material micropillar array has been fabricated via in situ integration of the liquid-crystalline elastomer-based component into the hybrid microdevice. Such design allows for developing pushing elements with fast lifetime values of ca. 5 s, and opens huge opportunities for the use of hybrid smart microdevices with total control on the actuation time/response, repeatability, stability and energy saving.