Four-Bits-Per-Cell Operation in an HfO2 -Based Resistive Switching Device

Small. 2017 Oct;13(40). doi: 10.1002/smll.201701781. Epub 2017 Aug 30.

Abstract

The quadruple-level cell technology is demonstrated in an Au/Al2 O3 /HfO2 /TiN resistance switching memory device using the industry-standard incremental step pulse programming (ISPP) and error checking/correction (ECC) methods. With the highly optimistic properties of the tested device, such as self-compliance and gradual set-switching behaviors, the device shows 6σ reliability up to 16 states with a state current gap value of 400 nA for the total allowable programmed current range from 2 to 11 µA. It is demonstrated that the conventional ISPP/ECC can be applied to such resistance switching memory, which may greatly contribute to the commercialization of the device, especially competitively with NAND flash. A relatively minor improvement in the material and circuitry may enable even a five-bits-per-cell technology, which can hardly be imagined in NAND flash, whose state-of-the-art multiple-cell technology is only at three-level (eight states) to this day.

Keywords: HfO2; error checking/correction (ECC) algorithm; incremental step pulse programming (ISPP); quadruple-level cell (QLC); resistive switching (RS) memory.

Publication types

  • Research Support, Non-U.S. Gov't