Effect of Post Treatment For Cu-Cr Source/Drain Electrodes on a-IGZO TFTs

Materials (Basel). 2016 Jul 27;9(8):623. doi: 10.3390/ma9080623.

Abstract

We report a high-performance amorphous Indium-Gallium-Zinc-Oxide (a-IGZO) thin-film transistor (TFT) with new copper-chromium (Cu-Cr) alloy source/drain electrodes. The TFT shows a high mobility of 39.4 cm 2 ·V - 1 ·s - 1 a turn-on voltage of -0.8 V and a low subthreshold swing of 0.47 V/decade. Cu diffusion is suppressed because pre-annealing can protect a-IGZO from damage during the electrode sputtering and reduce the copper diffusion paths by making film denser. Due to the interaction of Cr with a-IGZO, the carrier concentration of a-IGZO, which is responsible for high mobility, rises.

Keywords: Cu-Cr; TFTs; a-IGZO; electrodes; interfaces; semiconductors.