Two-dimensional materials (2DMs) are competitive candidates in replacing or supplementing conventional semiconductors owing to their atomically uniform thickness. However, current conventional micro/nanofabrication technologies realize hardly ultrashort channel and integration, especially for sub-10 nm. Meanwhile, experimental device performance associated with the scaling of dimension needs to be investigated, due to the short channel effects. Here, we show a novel and universal technological method to fabricate sub-10 nm gaps with sharp edges and steep sidewalls. The realization of sub-10 nm gaps derives from a corrosion crack along the cleavage plane of Bi2O3. By this method, ultrathin body field-effect transistors (FETs), consisting of 8.2 nm channel length, 6 nm high-k dielectric, and 0.7 nm monolayer MoS2, exhibit no obvious short channel effects. The corresponding current on/off ratio and subthreshold swing reaches to 106 and 140 mV/dec, respectively. Moreover, integrated circuits with sub-10 nm channel are capable of operating as digital inverters with high voltage gain. The results suggest our technological method can be used to fabricate the ultrashort channel nanopatterns, build the experimental groundwork for 2DMs FETs with sub-10 nm channel length and 2DMs integrated circuits, and offer new potential opportunities for large-scale device constructions and applications.
Keywords: 2D materials; Sub-10 nm; field-effect transistors; nanopatterns; very-large-scale integration.