Electrochemical deposition of layered copper thin films based on the diffusion limited aggregation

Chenhuinan Wei; Guoxing Wu; Sanjun Yang; Qiming Liu

doi:10.1038/srep34779

Electrochemical deposition of layered copper thin films based on the diffusion limited aggregation

Sci Rep. 2016 Oct 13:6:34779. doi: 10.1038/srep34779.

Authors

Chenhuinan Wei¹, Guoxing Wu¹, Sanjun Yang¹, Qiming Liu¹

Affiliation

¹ School of Physics and Technology, Key Laboratory of Ariticial Micro- and Nano-structures of Ministry of Education, Wuhan University, Wuhan 430072, China.

Abstract

In this work layered copper films with smooth surface were successfully fabricated onto ITO substrate by electrochemical deposition (ECD) and the thickness of the films was nearly 60 nm. The resulting films were characterized by SEM, TEM, AFM, XPS, and XRD. We have investigated the effects of potential and the concentration of additives and found that 2D dendritic-like growth process leaded the formation of films. A suitable growth mechanism based on diffusion limited aggregation (DLA) mechanism for the copper films formation is presented, which are meaningful for further designing homogeneous and functional films.

Publication types

Research Support, Non-U.S. Gov't